K Next: cold insole bonding with hot melt strength

What K Next is for

Some parts need a structural bond, like the one a hot melt adhesive gives, but shouldn't be exposed to heat sources. K Next fills that gap: the bond strength of a hot melt, applied without direct heat.

It is a cold insole bonding technology built for high-output production cells, and it keeps the process solvent-free. At the Simac 2025 trade show, ALC presented it as a polyurethane-based adhesive tape for structural bonding.

How it compares with K Thermo and K System

• [K Thermo](/en/systems/k-thermo) uses heat and pressure to melt the adhesive and bond; it's the choice when the material can take the temperature.
• [K System](/en/systems/k-system) uses pressure-sensitive adhesives that bond with pressure alone, usually on tape.
• K Next aims for hot melt strength without the heating step.

All three keep solvents out of the bond; what changes is how the adhesive is activated and what your material can tolerate.

When it makes sense

• When the material is heat-sensitive.
• When you want a process without heated presses.
• When you need a structural bond without solvents.

We go deeper in cold insole bonding: what it is and when to use it.

Getting started with K Next

K Next is a new line. Send us your materials and current process, and we'll check whether it fits your production and which formats are available.